Dissipating Module Structure for Heat Generating Device

ABSTRACT

The invention is to provide a heat dissipating module structure for a heat generating device. The heat dissipating module structure according to a preferred embodiment of the invention includes a heat-conducting device, a carrier, and a heat-conducting material. The first end of the heat-conducting device is inserted into the bore such that the top of the first end of the heating-conducting device is aligned with or close to the upper surface of the carrier. The heat-conducting material surrounds the upper surface of the carrier such that the heat-conducting material together with the upper surface provides a supporting plane. The heat generating device is to be mounted on the supporting plane. Moreover, the heat generated from the heat generating device is conducted from the first end of the heat-conducting device to the second end of the heat-conducting device.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a heat dissipating module structure, and moreparticularly, to a heat dissipating module structure for a heatgenerating device.

2. Description of the Prior Art

With the development of technology, there has not been any breakthroughfor the techniques of many electronic products due to the problem ofheat-dissipation. For example, a large amount of heat is generatedduring the operation of the central micro-processor in a computer. Ifthe heat can not be dissipated, it will lead to negative effect on theoperation of the whole system. Another example is the high powerlight-emitting diode illuminating equipment that has been extensivelyapplied and is being continually investigated and developed. Althoughhaving the advantages of electricity-saving and vibration-resisting,current high power light-emitting diode illuminating equipment has theproblem of overheating after being used for a long span of time,contributing to the reduction of lighting efficiency of thelight-emitting diode and limiting the brightness. Therefore, a heatdissipating module structure is essential to the enhancement of theefficiency of the electronic products.

SUMMARY OF THE INVENTION

Accordingly, a scope of the invention is to provide a heat dissipatingmodule structure for a heat generating device.

The first preferred embodiment of the invention provides a heatdissipating module structure for a heat generating device. The heatdissipating module structure includes a heat-conducting device, acarrier, and a heat-conducting material. The heat-conducting device hasa first end and a second end. The carrier has an upper surface, a bottomsurface, and a hollow bore adapted to receive the first end of theheat-conducting device. The heat-conducting device is inserted via thefirst end thereof into the bore, such that the top of the first end ofthe heat-conducting device is disposed near or aligned with the uppersurface of the carrier. The heat-conducting material surrounds the uppersurface of the carrier, such that the heat-conducting material togetherwith the upper surface of the carrier provides a supporting plane. Theheat generating device is to be mounted on the supporting plane.Moreover, the heat generated by the heat generating device is conductedfrom the first end of the heat-conducting device to the second end ofthe heating-conducting device.

A heat dissipating module structure for a heat generating device,according to the second preferred embodiment of the invention, includesa heat-conducting device, a carrier, and a heat-conducting material. Theheat-conducting device has a first end and a second end. The carrier hasan upper surface, a bottom surface, and a groove formed on the bottomsurface. The first end of the heat-conducting device is disposed intothe groove. The heat-conducting material fills up a residual spacebetween the first end of the heat-conducting device and the groove. Theheat generating device is mounted on the upper surface of the carrier.Moreover, the heat generated from the heat generating device isconducted from the carrier through the heat-conducting material and thefirst end of the heat-conducting device to the second end of theheating-conducting device.

The advantage and spirit of the invention may be understood by thefollowing recitations together with the appended drawings.

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

FIG. 1A is an outside perspective view of the heat dissipating modulestructure 1 according to the first preferred embodiment of theinvention.

FIG. 1B is an outside perspective view of the carrier 12 in FIG. 1A.

FIG. 1C is a cross section view of the carrier 12 of the heatdissipating module structure 1 in FIG. 1A.

FIG. 1D is another cross section view of the carrier 12 of the heatdissipating module structure 1 in FIG. 1A.

FIG. 1E is the perspective view relating the two cross section views ofthe carrier 12 of the heat dissipating module structure 1 in FIG. 1A,describing the manufacturing process of the heat dissipating modulestructure 1.

FIG. 2 is a cross section view of a heat pipe of the heat-conductingdevice 10 in FIG. 1A.

FIG. 3 is another outside perspective view of the heat dissipatingmodule structure 1 according to the first preferred embodiment of theinvention.

FIG. 4A is an outside perspective view of the heat dissipating modulestructure 2 according to the second preferred embodiment of theinvention.

FIG. 4B is an outside perspective view of the carrier 22 in FIG. 4A.

DETAILED DESCRIPTION OF THE INVENTION

The invention provides a heat dissipating module structure for a heatgenerating device.

Referring to FIG. 1A through FIG. 1E, the heat dissipating modulestructure 1 according to the first preferred embodiment of the inventionis revealed in the figures.

FIG. 1A is an outside perspective view of the heat dissipating modulestructure 1. As shown in FIG. 1A, the heat dissipating module structure1 includes a heat-conducting device 10, a carrier 12, and aheat-conducting material 14. The heat-conducting device 10 has a firstend 102 and a second end 104.

FIG. 1B is an outside perspective view of the carrier 12 in FIG. 1A. Asshown in FIG. 1B, the carrier 12 has an upper surface 122, a bottomsurface 124, and a hollow bore 126.

In one embodiment, the carrier 12 is formed of a metal material, aceramic material, or a polymer material.

FIG. 1C is a cross section view of the carrier 12 of the heatdissipating module structure 1. As shown in FIG. 1C, the hollow bore 126of the carrier 12 is adapted to receive the first end 102 of theheat-conducting device 10. The heat-conducting device 10 is inserted viathe first end 102 thereof into the bore 126 such that the top 106 of thefirst end 102 of the heat-conducting device 10 is disposed near oraligned with the upper surface 122 of the carrier 12.

The heat-conducting material 14 surrounds the upper surface 122 of thecarrier 12 such that the heat-conducting material 14 together with theupper surface 122 of the carrier 12 provide a supporting plane.

In one embodiment, the top 106 of the first end 102 of theheat-conducting device 10 is aligned with the upper surface 122 of thecarrier 12 as shown in FIG. C. The heat-conducting material 14 fills upa residual space formed by the gap between the bore 126 and the firstend 102 of the heat-conducting device 10. Practically, the carrier 12and the heat-conducting material 14 need to be smoothed further, suchthat the heat-conducting material 14 together with the upper surface 122of the carrier 12 provides a supporting plane.

In another embodiment, a distance exists between the upper surface 122of the carrier 12 and the top 106 of the first end 102 of theheat-conducting device 10 as shown in FIG. D. The heat-conductingmaterial 14 fills up a residual space, formed due to the distance, inthe bore 126 near the upper surface 122 of the carrier 12. In practice,the carrier 12 and the heat-conducting material 14 need to be smoothedfurther, such that the heat-conducting material 14 together with theupper surface 122 of the carrier 12 provides a supporting plane.

In another embodiment, referring to FIG. 1E, the top 106 of the firstend 102 of the heat-conducting device 10 is disposed outside the bore126 (as shown in the partial cross section view of the heat dissipatingmodule structure 1 on the left side of FIG. 1E), and then it is grinded,so that the top 106 of the first end 102 of the heat-conducting device10 is aligned with the upper surface 122 of the carrier 12 (as shown inthe partial cross section view of the heat dissipating module structure1 on the right side of FIG. 1E). The heat-conducting material 14 fillsup a residual space formed by the gap between the bore 126 and the firstend 102 of the heat-conducting device 10. In practice, the carrier 12and the heat-conducting material 14 need to be smoothed further, suchthat the heat-conducting material 14 together with the upper surface 122of the carrier 12 provide a supporting plane.

It should be noted that the corresponding heat generating device (notshown in the figure) is to be mounted on the plane. Moreover, the heatgenerated by the heat generating device during operation thereof isconducted from the first end 102 of the heat-conducting device 10 to thesecond end 104 of the heating-conducting device 10.

In one embodiment, the heat-conducting material 14 is a heat-conductingpaste such as a solder paste, a silver paste, a copper paste, or a pastematerial containing metal particles or ceramic particles. Practically,the heat-conducting paste fills up the residual space in the bore andthen is cured.

In one embodiment, the heat-conducting device 10 is a heat pipe or acylinder device formed of a material with high heat conductivity.

Referring to FIG. 2, a cross section view of the heat pipe is revealedand illustrated as the heat-conducting device 10. The heat-conductingpipe 10 includes a sealed metal pipe 101 and a porous capillarydiversion layer 103. The metal pipe 101 has a vacuumed capacity 105where there is a working fluid (not shown in the figure). The porouscapillary diversion layer 103 is formed inside the capacity 105 andcovers the inner wall of the metal pipe 101. What needs to be explainedis that one end of the sealed metal pipe 101, which is originallyunsealed, is sealed by heli-arc welding. Therefore, as shown in thecross section view of the heat pipe 10 in FIG. 2, the top 106 of thefirst end 102 of the heat pipe 10 is cohered to form a sphere afterbeing heated.

In one embodiment, the heat dissipating module structure 1 furtherincludes at least one heat-dissipating fin. The at least oneheat-dissipating fin is mounted on a periphery of the heat-conductingdevice 10. In another embodiment, the heat dissipating module structure1 further includes a heat sink. The heat sink is mounted on the secondend 104 of the heat-conducting device 10.

The heat dissipating module structure, according to the second preferredembodiment of the invention, includes a heat-conducting device, acarrier formed of a material with high heat conductivity, and aheat-conducting paste.

The heat-conducting device, having a first end and a second end, is aheat pipe or a cylinder device formed of a material with high heatconductivity. The first end 11 forms a spherical surface inside andoutside by sintering. Moreover, the heat-conducting device includes asealed metal pipe and a porous capillary diversion layer.

Referring to FIG. 1A, the shape of the heat-conducting device 10 of theheat dissipating module structure 1 according to the invention could bea straighten pipe for practical application. Referring to FIG. 3, forparticular application, the shape of the heat-conducting device 10 ofthe heat dissipating module structure 1 according to the invention couldbe bended appropriately upon practical demand.

Referring to FIG. 4A and FIG. 4B, the heat dissipating module structure2 according to the second preferred embodiment of the invention isrevealed in the figure.

FIG. 4A is an outside perspective view of the heat dissipating modulestructure 2. Referring to FIG. 4A, the heat dissipating module structure2 includes a heat-conducting device 20, a carrier 22, and aheat-conducting material 24. The heat-conducting device 20 has a firstend 202 and a second end 204.

FIG. 4B is an outside perspective view of the carrier 22. Referring toFIG. 4B, the carrier 22 has an upper surface 222, a bottom surface 224,and a groove 226. The groove 226 of the carrier 22 is formed on thebottom surface 224 and adapted to receive the first end 202 of theheat-conducting device 20.

Referring to FIG. 4A, the first end 202 of the heat-conducting device 20is disposed into the groove 226. The heat-conducting material 24 fillsup a residual space between the first end 202 of the heat-conductingdevice 20 and the groove 226.

It should be noted that the corresponding heat generating device (notshown in the figure) is to be mounted on the upper surface 222 of thecarrier 22. Moreover, the heat generated by the heat generating deviceduring operation thereof is conducted from the carrier 22 through theheat-conducting material 24 and the first end 202 of the heat-conductingdevice 20 to the second end 204 of the heating-conducting device 20.Practically, the outer diameter of the first end 202 of theheat-conducting device 20 is substantially equal to the depth of thegroove 226 and is also allowed to be less or larger than the depth ofthe groove 226.

The material, manufacturing process, and the shape of each device in theheat dissipating module 2 according to the second preferred embodimentof the invention are the same with those of each device in the heatdissipating 1 according to the first preferred embodiment of theinvention. Hence, descriptions will not be repeated here.

In one embodiment, the heat dissipating module structure 2 furtherincludes at least one heat-dissipating fin. The at least oneheat-dissipating fin is mounted on a periphery of the heat-conductingdevice 20. In another embodiment, the heat dissipating module structure1 further includes a heat sink. The heat sink is mounted on the secondend 204 of the heat-conducting device 20.

With the example and explanations above, the features and spirits of theinvention will be hopefully well described. Those skilled in the artwill readily observe that numerous modifications and alterations of thedevice may be made while retaining the teaching of the invention.Accordingly, the above disclosure should be construed as limited only bythe metes and bounds of the appended claims.

1. A heat dissipating module structure for a heat generating device, theheat dissipating module structure comprising: a heat-conducting devicehaving a first end and a second end; a carrier having an upper surface,a bottom surface and a hollow bore, the first end of the heat-conductingdevice being inserted into the hollow bore and the top of the first endof the heat-conducting device is disposed near or aligned with the uppersurface of the carrier; and a heat-conducting material surrounding theupper surface of the carrier such that the heat-conducting materialtogether with the upper surface of the carrier provides a supportingplane; whereby when the heat generating device is mounted on thesupporting plane, the heat generated from the heat generating device isconducted from the first end of the heat-conducting device to the secondend of the heating-conducting device.
 2. The heat dissipating modulestructure of claim 1, wherein the top of the first end of theheat-conducting device is aligned with the upper surface of the carrier.3. The heat dissipating module structure of claim 2, wherein the top ofthe first end of the heat-conducting device is disposed outside thebore, and then grinded so that the first end of the heat-conductingdevice is aligned with the upper surface of the carrier.
 4. The heatdissipating module structure of claim 1, wherein a distance existsbetween the upper surface of the carrier and the top of the first end ofthe heat-conducting device.
 5. The heat dissipating module structure ofclaim 1, wherein the carrier is formed of a metal material, a ceramicmaterial or a polymer material.
 6. The heat dissipating module structureof claim 1, wherein the heat conducting material is a heat-conductingpaste, the heat-conducting paste fills up the residual space in thebore, and then it is cured.
 7. The heat dissipating module structure ofclaim 1, wherein the heat-conducting paste is one selected from thegroup consisting of a solder paste, a silver paste, copper paste, apaste material containing metal particles and a paste materialcontaining ceramic particles.
 8. The heat dissipating module structureof claim 1, wherein the heat-conducting device is a heat pipe or acylinder device formed of a material with high heat conductivity.
 9. Theheat dissipating module structure of claim 1, further comprising atleast one heat-dissipating fin mounted on a periphery of theheat-conducting device.
 10. The heat dissipating module structure ofclaim 1, further comprising a heat sink mounted on the second end of theheat-conducting device.
 11. A heat dissipating module structure for aheat generating device, the heat dissipating module structurecomprising: a heat-conducting device having a first end and a secondend; a carrier having an upper surface, a bottom surface and a groove,the groove formed on the bottom surface and the first end of theheat-conducting device being disposed into the groove; and aheat-conducting material, filling up a residual space between the firstend of the heat-conducting device and the groove; whereby when the heatgenerating device is mounted on the upper surface of the carrier, theheat generated from the heat generating device is conducted from thecarrier through the heat-conducting material and the first end of theheat-conducting device to the second end of the heating-conductingdevice.
 12. The heat dissipating module structure of claim 11, whereinthe outer diameter of the first end of the heat-conducting device issubstantially equal to the depth of the groove.
 13. The heat dissipatingmodule structure of claim 11, wherein the outer diameter of the firstend of the heat-conducting device is less than the depth of the groove.14. The heat dissipating module structure of claim 11, wherein the outerdiameter of the first end of the heat-conducting device is larger thanthe depth of the groove.
 15. The heat dissipating module structure ofclaim 11, wherein the carrier is formed of a metal material or a ceramicmaterial.
 16. The heat dissipating module structure of claim 11, whereinthe heat-conducting material is a heat-conducting paste, theheat-conducting paste fills up the residual space in the groove and thenis cured.
 17. The heat dissipating module structure of claim 16, whereinthe heat-conducting paste is one selected from the group consisting of asolder paste, a silver paste, copper paste, a paste material containingmetal particles and a paste material containing ceramic particles. 18.The heat dissipating module structure of claim 11, wherein theheat-conducting device is a heat pipe or a cylinder device formed of amaterial with high heat conductivity.
 19. The heat dissipating modulestructure of claim 11, further comprising at least one heat-dissipatingfin mounted on a periphery of the heat-conducting device.
 20. The heatdissipating module structure of claim 11, further comprising a heat sinkmounted on the second end of the heat-conducting device.